Model: Lam AutoEtch 590

Original Equipment Manufacturer:Lam Research

Condition: Complete, Working Condition, fully tested before shipping by seller. New PC controller with touch Screen Monitor, 6 gas lines with 5 MFC, ENI OEM-12A RF Generator, Motorized wafer ARM movement with controller.

Wafer Size: 4”,5”,6” capability

Valid Time: Subject to prior sale

Lead Time: 12-24 weeks depending on po time.

Location: Morgan Hill, CA, U.S.A.

Warranty: 6months non-consumable parts warranty 

Installation and training: Available at extra charge for refurbished condition

Service Contract: Available at extra charge

Lam AutoEtch 590 description for reference only.

 1.1 The Lam Research Corporation (LRC) Lam AutoEtch590  is an in-Line  cassette to cassette, fully automated, single wafer,double air-locked, parallel plate plasma etching system.  The etching program is saved on a recipe programming module. The entire Lam AutoEtch590 system is under automatic , closed-loop feedback control and is double keylocked to prevent accidental  alteration of the process.

The Lam AutoEtch590 has a CRT monitor display for monitoring the machine status and the process parameters. The operating pressure, RF power, electrode spacing, gas flow rates, and step terminating modes are programmable for each step.

1.2 Lam AutoEtch590 plasma etcher plasma etch semiconductor equipment Process Chamber

A wafer is transferred from a send cassette to the entrance station. From the entrance station, it moves into an entrance air lock and then into the process chamber where it is etched by a computer controlled gas plasma discharge. The wafer is then moved from the process chamber to the exit airlock, from the exit airlock to the exit station, and is finally transported to the receive cassette. The double airlocks allow the process chamber to remain under vacuum at all times. The process chamber is located behind the operator Interface display. The operator interface is hinged and will swing up allowing visual access to the process chamber.

The process chamber is equipped with quartz windows on the front and back. Each· window has a wire mesh screen to contain the RF field and a plexiglass cover for UV filtering. The windows at low for observation of the etching process. The front window plate also serves as the mounting point for the capacitance manometer and a pressure switch.

The major sub-systems of ·the process chamber are: the Iower electrode assembly, the electrode gap drive, the upper electrode, and the RF match assembly. The chamber is anodized in order to prevent reaction with the etching gases. Care must be exercised to prevent damage to this anodized coating.

The valid time is subject to prior sale without notice.