This listing is for a vintage CORWIL Technology Corporation semiconductor die storage case containing processed components. The package features full manufacturing traceability markers from an official OSAT (Outsourced Semiconductor Assembly and Test) run, making it a great find for electronics collectors, semiconductor historians, gold/silicon recovery, or laboratory reference.

The case is brand new sealed , containing 4 Silicon Semiconductor DIE Chips inside .

silicon semiconductor die, likely a CPU or image sensor, which is part of an integrated circuit.

Type: Semiconductor wafer die (integrated circuit).

Technology: BSI (Back-Side Illuminated) technology, often used in CMOS image sensors for better light sensitivity.

Application: Found inside processors (CPUs) or cameras.

Form: The die is mounted on a substrate and protected by a transparent case

Item Specifications:

Manufacturer: CORWIL Technology Corporation

Part Number: MCR1463

Lot Number: P93H60 / Job # 181602-2-1

Wafer Number: 19

Date of Processing: 05/13/16

Contents: 4x "DIE A" microchip components stored inside a protective Gel-Pak carrier

Condition: New Old Stock (NOS) / Surplus enclosure. Sealed with ESD-safe security tape.