Up for sale is a RARE factory lot of 50 genuine Microsoft "Lando" Application-Specific Integrated Circuit (ASIC) chips, part number M1042068-005. These are 224-pin Ball Grid Array (BGA) components used in proprietary Microsoft hardware architectures. The lot is safely housed inside its original moisture-sensitive protective ESD barrier packaging.

Key Features

Genuine OEM Component: Authentic Microsoft semiconductor lot.

Advanced Package Type: 224-Pin BGA design engineered for high-density surface mounting.

Code Name: Internal project/architecture designation "Lando".

Bulk Industrial Lot: Contains exactly 50 pieces per pack, ideal for repairs, manufacturing, or hardware development.

**Condition Notice:**

This item is a factory-sealed prototype component sample. Please note that engineering samples are intended strictly for developmental research, collection, or educational evaluation. Sold as-is. Please verify compatibility with your equipment or collection requirements prior to purchasing.

Fast shipping. Item will be packed carefully in anti-static ESD packaging and climate-controlled protective materials to maintain its condition.