- Paste container positioned at 45° angle, rotating along axis. Prevents adhesion to lid.
- Time-relay controlled operation. Simple interface, high reliability.
- Efficient bubble removal during mixing process.
- Sealed mixing chamber prevents oxidation and moisture absorption.
- Optimized speed ratio minimizes tin impact and temperature rise.
Microprocessor-controlled automatic mixer. Ensures homogeneous blending of tin and solder paste without opening container. Eliminates oxidation and humidity issues. Significantly improves efficiency and consistency over manual stirring.








