1. Exceptional Wi-Fi performance: Integrated IEEE 802.11b/g/n protocols ensure high-speed, stable connectivity.
2. Advanced Bluetooth subsystem: Supports Bluetooth 5 (LE) and Bluetooth Mesh for extended-range communication.
3. Efficient data processing: Built-in 32-bit LX7 dual-core processor delivers robust computational power with low-power consumption.
4. Integrated Wireless Functionality: Wi-Fi and Bluetooth LE share a single antenna, optimising multitasking.
5. High-Temperature Stability: Maintains superior performance and stable operation in elevated temperatures, suitable for demanding environments.
The ESP32-S3 integrates 2.4GHz Wi-Fi (802.11b/g/n) with support for 40MHz bandwidth. Its low-power Bluetooth subsystem supports Bluetooth 5 (LE) and Bluetooth Mesh, enabling long-range communication via Coded PHY and broadcast extension. It additionally supports 2Mbps PHY for enhanced transmission speeds and data throughput. The ESP32-S3 delivers outstanding Wi-Fi and Bluetooth LE RF performance, maintaining stable operation even at elevated temperatures.
Supports IEEE 802.11b/g/n protocols
Supports 20MHz and 40MHz bandwidths in the 2.4GHz band
Supports 1T1R mode with data rates up to 150Mbps
Wireless Multimedia (WMM)
Frame aggregation (TX/RX A-MPDU, TX/RX A-MSDU)
Immediate BlockACK
Fragmentation/defragmentation
Low Energy Bluetooth (Bluetooth LE): Bluetooth 5, Bluetooth Mesh
High-power mode (20dBm)
Supported rates: 125Kbps, 500Kbps, 1Mbps, 2Mbps
Wi-Fi and Bluetooth coexistence, sharing a single antenna
32-bit LX7 dual-core processor, maximum clock speed up to 240MHz
PCB board dimensions: 62.6mm × 28.3mm
Lens: 1/4-inch
Effective Focal Length (EFL): 1.68mm
F-Number (F.NO): 2.2
Field of View (FOV): 120°
Distortion: <13.5%
Lens Size: 1/5-inch
Image Sensor Chip Type: OV3660
Pixel Array Size: 2048 × 1536
Analogue Circuit Voltage (AVDD): 2.8V
Interface Circuit Voltage (DOVDD): 1.8V–2.8V
Digital Circuit Voltage (DVDD): 1.5V
1 × Development Board
1 × OV3660 Camera Module
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