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Intel Celeron SL4NY 633MHz/128KB/66MHz/1.7V Socket 370 FC-PGA Processor CPU

Intel Celeron SL4NY 633MHz/128KB/66MHz/1.7V Socket 370 FC-PGA Processor CPU

The Intel Celeron SL4NY is a 633MHz Socket 370 FC-PGA processor based on Intel's Coppermine core, manufactured circa 2000. Running on a 66MHz front side bus with 128KB of on-die L2 cache at full core speed and a 1.7V core voltage, it is pin-compatible with Socket 370 motherboards supporting FC-PGA CPUs. Note: the current listing name incorrectly identified this chip as a Pentium III — the die label clearly reads Celeron, and the SL4NY sSpec is an Intel Celeron 633 designation.

Specifications & What's Included

  • Brand: Intel
  • Processor family: Celeron (Coppermine core)
  • sSpec / OPN: SL4NY
  • Clock speed: 633 MHz
  • Front side bus (FSB): 66 MHz
  • L2 cache: 128 KB (on-die, full-core speed)
  • Core voltage (Vcore): 1.7V
  • Socket: Socket 370 (FC-PGA)
  • Country of manufacture: Malaysia
  • Lot code (visible on label): Q045A655-0871
  • Processor only — no heatsink or fan included

Applications

The Intel Celeron 633 targets the late-1990s to early-2000s Socket 370 desktop platform, used in budget and entry-level systems built around Intel 810, 815, and similar chipset motherboards from that era. The FC-PGA package replaced the earlier PPGA package and is compatible with a wide range of Socket 370 boards, including those that also supported Pentium III Coppermine processors at the same socket — though FSB and voltage compatibility should be confirmed for any specific board. These processors are primarily sought today for restoring or maintaining period-correct Socket 370 systems, vintage PC builds, and retro computing projects. The 66MHz FSB and 128KB L2 cache are the key differentiators from the contemporaneous Pentium III, which ran a 100 or 133MHz FSB with 256KB cache.

Condition: Used
This Intel Celeron SL4NY 633MHz Socket 370 processor has been inspected and appears to be in good used condition. The pins on the underside are intact with no visible bending or damage. There is dried thermal compound residue on the processor die from prior installation, which is normal for a pulled processor and can be cleaned before reuse. The die label markings are clear and legible. Please view our photo set and contact us if you have any questions. Please note: We have multiple units in stock — yours may not be the one shown in the photos, however, it will be similar in condition and function.

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