| Mfr Package Description | TQFP-100 |
| Status | In Stock |
| Access Time-Max | 3.8 ns |
| JESD-30 Code | R-PQFP-G100 |
| JESD-609 Code | e0 |
| Memory Density | 4718592.0 bit |
| Memory IC Type | CACHE SRAM |
| Memory Width | 36 |
| Number of Functions | 1 |
| Number of Terminals | 100 |
| Number of Words | 131072.0 words |
| Number of Words Code | 128K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 70.0 Cel |
| Organization | 128KX36 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LQFP |
| Package Shape | RECTANGULAR |
| Package Style | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.6 mm |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Supply Voltage-Min (Vsup) | 3.135 V |
| Supply Voltage-Max (Vsup) | 3.465 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN LEAD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65 mm |
| Terminal Position | QUAD |
| Length | 20.0 mm |
| Width | 14.0 mm |
| Additional Feature | PIPELINED ARCHITECTURE |