| Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT |
| JESD-30 Code | S-PBGA-B909 |
| JESD-609 Code | e1 |
| Number of Functions | 1 |
| Number of Terminals | 909 |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA909,34X34,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.51 mm |
| Sub Category | Other Telecom ICs |
| Supply Voltage-Nom | 1.5 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 1.0 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Length | 35.0 mm |
| Width | 35.0 mm |