| Mfr Package Description | PLASTIC, BGA-260 |
| REACH Compliant | - |
| Status | In Stock |
| Microprocessor/Microcontroller/Peripheral IC Type | DIGITAL SIGNAL PROCESSOR, OTHER |
| Address Bus Width | 26 |
| Barrel Shifter | YES |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 33.33 MHz |
| External Data Bus Width | 32 |
| Format | FIXED POINT |
| Internal Bus Architecture | MULTIPLE |
| JESD-30 Code | S-PBGA-B260 |
| JESD-609 Code | e0 |
| Low Power Mode | YES |
| Number of Terminals | 260 |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 85 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA260,18X18,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 220 |
| Power Supplies | 1.5,3.3 |
| Qualification Status | Not Qualified |
| RAM (words) | 32768 |
| Seated Height-Max | 2.5 mm |
| Sub Category | Digital Signal Processors |
| Supply Voltage-Nom | 1.5 V |
| Supply Voltage-Min | 0.8600 V |
| Supply Voltage-Max | 1.57 V |
| Surface Mount | YES |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | BALL |
| Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Length | 19 mm |
| Width | 19 mm |