Ultra-Flat Double Side Polished (DSP) Silicon Wafers — Research Grade

Designed for high-end semiconductor fabrication, nanotechnology research, and advanced micro-optics, our Double-Side Polished (DSP) silicon substrates offer exceptional flatness and an industry-leading mirror finish on BOTH surfaces.

These wafers are the ideal choice for applications requiring light transmission, double-sided lithography, or multi-layer device fabrication.

Technical Specifications

Property Details
Material Quality CZ High-Purity Monocrystalline Silicon (Si)
Surface Finish Double-Side Polished (DSP) — Mirror finish on BOTH sides
Surface Roughness Ra < 0.5 nm (Atomic flatness)
Crystal Orientation <100>
Available Diameters 2", 3", 4", 5", 6", 12"
Primary Applications MEMS, E-beam Lithography, SEM/TEM Carriers, Optics

Key Features

Cleanroom Packaging & Secure Logistics

Buyer's Guide & Cross-Promotion