21% VAT included - Grade A - Contact me for bulk deal , 100+ in stock


Intel Xeon Gold 6268CL CPU Processor 24 Core SRF80 33MB L3 Cache LGA 3647


Compatible with for example HP Z6 G4 (see picture)


Invoice possible - contact me



Grade A original genuine processor




General information
TypeCPU / Microprocessor
Market segmentServer
FamilyIntel Xeon Gold
Model number  ? 
6268CL
Part number
 
Frequency  ? 
2.8 GHz / 2800 MHz
Maximum turbo frequency
3.9 GHz / 3900 MHz
Low power frequency1200 MHz [1]
Bus speed  ? 10.4 GT/s Ultra Path Interconnect [1]
Clock multiplier  ? 28
Package3647-land Flip-Chip Land Grid Array (FC-LGA)
SocketSocket 3647 / P0 / LGA3647-0
Size2.99" x 2.22" / 7.6cm x 5.65cm
S-spec numbers
Part numberProduction processors
 SRF80
Unknown+
Architecture / Microarchitecture
Instruction setx86
MicroarchitectureCascade Lake
Processor core  ? Cascade Lake-SP
CPUIDs
50657
Manufacturing process0.014 micron
Data width
64 bit
The number of CPU cores24
The number of threads
48
Floating Point UnitIntegrated
Level 1 cache size  ? 
24 x 32 KB instruction caches
24 x 32 KB data caches
Level 2 cache size  ? 
24 x 1 MB caches
Level 3 cache size
33 MB cache
Cache latency4 (L1 cache)
14 (L2 cache)
MultiprocessingUp to 2 processors [1]
Extensions & Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • AVX-512 / Advanced Vector Extensions 512
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • Deep Learning Boost
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64  ? 
  • HT / Hyper-Threading technology  ? 
  • VT-x / Virtualization technology  ? 
  • TBT 2.0 / Turbo Boost technology 2.0  ? 
  • TSX / Transactional Synchronization Extensions
Security Features
NX / XD / Execute disable bit  ? 
Low power featuresEnhanced SpeedStep technology  ? 
Integrated Graphics Processing Unit
None 
Integrated peripherals / components
Memory controllerThe number of controllers: 2
Memory channels (per controller): 3
Memory channels (total): 6
Supported memory: DDR4
Other peripherals
  • Ultra Path Interconnect
  • PCI Express 3.0 interface (48 lanes)
Electrical / Thermal parameters
Thermal Design Power  ? 205 Watt [1]