AMAOE Mbga-MY4 4 IN 1 BGA153 Reballing Stencil 0.15mm Special For Tin Planting Station Mobile Phone CPU IC BGA Tin Mesh Repair Tool

Product Description

Brand: AMAOE 阿毛易修

Model: Mbga-MY4

Thickness: 0.15mm

Specification: 4 IN 1 BGA153 layout, 4 identical BGA153 templates on one stencil

Special Design: Dedicated for automatic tin planting station, positioning hole for fixed installation

Material: Super hard stainless steel, not easy to deform, long service life

Application: Reballing BGA153 IC for mobile phone motherboard repair

Advantages: Uniform tin paste distribution, no tin overflow, precise pin hole alignment

Package: 1 Piece Steel Stencil