









Silver Cooling High Performance Thermal Grease Compound Paste Syringe. For CPU GPU VGA LED Heatsink Fan Chipset Chip Heat Spreader.
Low Thermal Resistance / High Conductivity for heat transfer / High Density
HY882 series Silver Thermal Grease contains Silver AGO & Silver Powder-High Cooling Performance Material To Improve Thermal Conductivity, Better than Regular Types and Good Partner For CPU / VGA Cooler
Compliance with RoHS REACH PFOS requirements
Thermal Conductivity: >3.17W/m-k
Thermal Resistance: <0.067 C-in2/W
Color: Silver
Thermal Conductivity: >3.17
Thermal Impendance: <0.067
Specific Gravity: 1.35
Thixotropic Index: 350+/-10
Moment Bore Temperature: -50-280
Operation Temperature: -30-230
Ingredients:
Silicone Compounds: 20%
Carbon Compounds: 20%
Metal Oxide Compounds: 60%
Weight:1G
Quantity:5PCS
Warning: This is not a Glue!! The sole purpose of this paste is to stay moist and provide additional cooling.
Warning: If this paste does not provide additional cooling, then there is a problem with either a Circuit Board due to bad capacitors or a short, or is in CPU / GPU Chip due to solder cracking and chip damage because of overheating for significant period of time.
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We are authorize distributor, our all items are 100% original and Our devices have warranty,
5 Year free repair for the devices.
In case an item arrives faulty, please contact us as soon as possible and keep it unused.
We will instruct you on how to return and get refund or replacement.
If the item has been used, we have the right to decline your claim.
Items should be returned on buyers' cost for repair or replacement.
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| Compatible Brand | For Acer, For Alienware, For Apple, For ASUS, For Averatec, For Clevo, For Compaq, For Dell, For eMachines, For Everex, For Gateway, For GIGABYTE, For HP, For IBM, For Lenovo, For LG, For Micron, For MSI, For Samsung, For Sony |
|---|---|
| Thermal Resistance | <0.067 C-in2/W |
| Color | Silver |
| Metal Oxide Compounds | 60% |
| Silicone Compounds | 20% |
| Material | Silver AGO & Silver Powder-High Cooling Material |
| Maximum Airflow Volume | All |
| MPN | SILV30G2X-HY710, GPU CPU VGA LED Heatsink Fan, Chip Chipset Heat Spreader, Pure Silver, Conductive 30g 30 gram, LOT OF TWO X2 2X PIECES |
| Thermal Conductivity | >3.17W/m-k |
| Thixotropic Index | 350+/-10 |
| To Fit | VGA, GPU, LED, Heatsink, Chipset, Chip, Chipset - Northbridge, Chipset - Southbridge, GPU Processor |
| Fan Light Color | Multicolor |
| Carbon Compounds | 20% |
| Brand | Unbranded |
| Fan Diameter | all |
| Type | Thermal Compound |
| Power Connection | None |
| Maximum Fan Speed | All |
| Moment Bore Temperature | -50-280 |
| Packaging | Syringe |
| Operation Temperature | -30-230 |
| Specific Gravity | 1.35 |
| Unit Quantity | 5 |
| Unit Type | Unit |
