Boost your system’s cooling efficiency with this advanced thermal compound. Designed with carbon micro-particles, it offers superior thermal conductivity of 12.8 W, ensuring rapid heat transfer from CPU or GPU to the heatsink for stable, high-performance computing.
Ultra-High Thermal Conductivity – Carbon-based formula delivers exceptional heat dissipation for CPUs and GPUs.
Safe & Non-Conductive – Metal-free and electrically non-conductive to eliminate the risk of short circuits.
Long-Lasting Durability – Maintains performance for up to 8 years without drying or degrading.
Easy to Apply – Smooth consistency makes it beginner-friendly while ensuring even spread.
Optimized for Performance – Perfect for overclocking, gaming rigs, and high-demand PC builds.
This professional-grade thermal paste has a unique, firm texture (semi-solid, clay-like) with no silicone oil or additives — designed for consistent long-term conductivity. For best results, apply 5–9 small points on the CPU surface and allow heatsink pressure to evenly distribute the compound.





