SOP8 S08 SOIC8 TSSOP8 MSOP8 SOT89 to DIP Adapter Converter Board SMD Breakout IC

 
 

Pin spacing: front 1.27mm/back 0.65mm

Level: Double sided

Insulation material: organic resin

Flame retardant properties: VO board

Insulation layer thickness: conventional board

 

These tiny boards are useful for modding and upgrading SMD components to a DIP footprint.

You can also use these adapters for prototyping by making SMD packages compatible with solderless breadboards.

 

 
 

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