Logitech CDP 1CM53 Chemical Delayering & Planarization CMP Polisher System
Comes with what you see in the pictures. If you don't see it, you probably won't get it.
Specifications are from a 3rd party and may vary slightly due to upgrades, options, or revisions this unit may or may not have.
This unit looks to be in great condition. It was excess stock from a refurbishment company. There are 2 connectors that are not plugged in to anything in the bottom. We do not have the facility requirements or expertise to test this unit. We are selling it as-is, for parts or not working as such.

The Unit's Serial Number Tag Reads:
Model Number: 1CM53
Serial Number: 84-01-07
Power Requirements: 220-240 VAC, 50-60 Hz, Single Phase, 10 A
CE Marked: Yes

Additional Information:
Platen Size: 19.625"~ Dia.
Holder Size: 5"~ Dia. (I believe this is correct. I measured inbetween 2 white polymer plastic pieces.)

Key Features:

  • Minimal subsurface damage
  • Wide range of wafer sizes can be polished, up to 200 mm to single integrated circuit (IC) capability
  • Robust, corrosion resistant construction
  • Fine etch polishing of semiconductor wafers and electro-optic crystals
  • Automated process control for repeatable results

    • Description:
    The CDP automatic allows the operator to achieve industry standards of control and layer removal for traditional CMOS technology, CMP applications, such as STI and Damascene (acceptable Within Wafer Non-Uniformity (WIWNU) and Within Die Non-Uniformity (WIDNU) are achievable). The CDP automatic can also be used for non-traditional planarisation applications, such as hard substrate polishing, Epi-ready surface preparation or wafer reclamation, and will produce accurate and repeatable results to within required measurement parameters.

    Laser quality surfaces (0/0 scratch dig), improvements to surface topography and Ra to subnanometer levels on substrates are all achievable using the CDP automatic.

    This level of diversity makes the CDP ideal for the testing of new CMP slurries, pads and templates for off line analysis and for off line trials of new CMP processes without the need to stop production runs.

    Various process parameters such as:

  • Platen rotational speed
  • Carrier rotational speed, down force, and back pressure
  • Carrier sweep speed and linear travel
  • Platen temperature
  • Slurry flow rate
  • In-situ conditioning of the polishing pad
  • Multiple memory locations for process storage

    • $150.00 minimum for packaging, handling, and order processing. Shipping to be determined by destination.

    Prior to shipment I will need to know the following information (filled out on a form that I will send you) for International Customers or Packages/Freight being Forwarded internationally. International customers may also be subject to a freight forwarder form if applicable.:

    (1) Are you the end-user of this item?

    (2) If you are not the ultimate end-user of the item, please state the ultimate end user's name.

    (3) What is the ultimate country destination?

    05/22/23