10pcs Universal Heat Rework PCB Soldering Solder Repair BGA Reball Reballing Stencil Template For Ball Grid Array Direct Heat


A set of high quality steel stencils for the direct application of heat to repair and reball Ball Grid Array (BGA) devices.


Stencil Templates
1x 0.3mm Universal Stencil (Pitch - 0.58mm)
30mm x 30mm
1x 0.35mm Universal Stencil (Pitch - 0.65mm)
30mm x 30mm
1x 0.4mm Universal Stencil (Pitch - 0.78mm)
37mm x 37mm
1x 0.45mm Universal Stencil (Pitch - 0.78mm)
37mm x 37mm
1x 0.50mm Universal Stencil (Pitch - 0.8mm)
40mm x 40mm
1x 0.55mm Universal Stencil (Pitch - 1.02mm)
52mm x 52mm
1x 0.6mm Universal Stencil (Pitch - 0.9mm)
40mm x 40mm
1x 0.6mm Universal Stencil (Pitch - 1.0mm)
51mm x 51mm
1x 0.6mm Universal Stencil (Pitch - 1.1mm)
51mm x 51mm
1x 0.76mm Universal Stencil (Pitch - 1.27mm)
51mm x 51mm

Detail
10pcs BGA Reball Stencils
Material: Steel
Colour: Silver
Use a hot air gun to apply heat directly to easily and effectively reball the BGA


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