ALCOHOL BASED SOLDERING LIQUID FLUX SMD/RMA REWORK, REFLOW, REBALL NO CLEAN TK83
Liquid, medium-active flux, type 1.1.2 / 3 A acc. to ISO 9454-1, which is an alcoholic solution of rosin with the addition of organic activators, max. soldering temperature 280°C. Solids content 24%. Ideally suited for manual tinning to restore solderability.
Usage Instructions
The flux can be applied to foam plates, wave flux, immersion and brush.
The flux and its residues do not show corrosion after soldering, so they do not need to be removed.
Where residues are required, wash with an alcoholic alcohol, ethyl alcohol or isopropyl alcohol remover.