1pcs Indium sheet In100 Indium film Indium foil Indium plate material In99.999%
High Purity Indium Sheet In100 Indium Film Indium Foil Metal Indium Indium Tape Indium Plate Ultra-low Temperature Sealing Material In99.999%
Chinese name: Indium
English name: Indium
Melting point: 156.61℃
Element symbol: In
Boiling point: 2060℃
Density: 7.31
physical properties
Indium is a silver-grey, extremely soft, fusible metal. Melting point 156.61 ℃. Boiling point 2060℃. Relative density d7.30. Liquid indium wets the glass and adheres to the surface it touches leaving a black mark.
Indium is a silvery white and slightly bluish metal that is so soft that it can be scored with a fingernail. Indium has strong plasticity and ductility, and can be pressed into sheets. Metal indium is mainly used as a raw material for the manufacture of low-melting alloys, bearing alloys, semiconductors, and electric light sources.
Application field
Pure indium sheet application: ultra-low temperature sealing
Indium is an ideal material for many sealing applications, especially for ultra-low temperature sealing such as liquid nitrogen. The use of indium in cryogenic sealing has the following advantages:
*Indium can maintain ductility and malleability at ultra-low temperature, and will not crack and break at low temperature of -150°C. This ductility and malleability is maintained at ultra-low temperatures, so assemblies remain effectively sealed even in harsh environments.
*Indium has good ductility and malleability, and can deform and fill tiny uneven gaps between two mating parts with only moderate pressure.
Indium is soft and tough, and can fill the gap between the two metal surfaces to form a complete seal. Because of its softer nature, it is also used for caulking in some industries that need to be filled with metal. Such as: vacuum gap filler material at higher temperatures.
Common sealing operations require sealing between channels or other uneven surfaces.
Indium does not require reflow to compensate for these defects.
*Indium has a high thermal conductivity (86W/mK), so it is widely used in thermal management applications to dissipate the heat generated by electronic components. Heat dissipation, heat conduction, refrigeration of electronic devices and semiconductors, sealing materials (vacuum sealing foils) of power devices, etc.
The package includes:
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