Technology | CMOS |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm |
| Terminal Finish | TIN LEAD |
| Terminal Position | DUAL |
| Number of Functions | 1 |
| Number of Terminals | 32 |
| Package Body Material | PLASTIC/EPOXY |
| Temperature Grade | COMMERCIAL |
| Memory Width | 8 |
| Organization | 128K X 8 |
| Memory Density | 1.05E6 deg |
| Operating Mode | ASYNCHRONOUS |
| Number of Words | 131072 words |
| Number of Words Code | 128K |
| Operating Temperature-Max | 70 Cel |
| Operating Temperature-Min | 0.0 Cel |
| Supply Voltage-Max (Vsup) | 5.5 V |
| Supply Voltage-Min (Vsup) | 4.5 V |
| Supply Voltage-Nom (Vsup) | 5 V |
| Memory IC Type | STANDARD SRAM |
| Parallel/Serial | PARALLEL |
| Access Time-Max (tACC) | 70 ns |