T-862 Electric Infrared BGA Rework Station: Repair, Testing and Desoldering Station for Small Electronic Device Motherboards

T-862
Infrared BGA Reflow Station
Temperature range: 100°C–350°C
Preheating system: 350W
Component desoldering area: 15×15–25×25 mm
Power: 600W
Preheating area: 120×80 mm
Net weight: 8 kg
Power Supply Voltage: AC 220V 50Hz
Packaging Dimensions: 460 x 340 x 305 mm

T-862++ Infrared BGA Rework Station
Temperature Range: 100°C–350°C
Component Removal Size: 15 x 15–25 x 25 mm
Preheating area: 120 x 80 mm
Net weight: 10 kg
Preheating solder system: 350 W
Power: 600 W
Power supply voltage: AC 220 V, 50 Hz
Packaging dimensions: 460 x 340 x 305 mm