Benchmark Results

Benchmark Results

Test NameHP_Envy_15_TouchSmartLenovo_IdeaPad_Y510P
CPU - Integer Math15613.415574.1
CPU - Floating Point Math6796.25889.7
CPU - Prime Numbers26.724.2
CPU - Extended Instructions (SSE)17.838.5
CPU - Compression4188.58409.7
CPU - Encryption600.11478.3
CPU - Physics215.5398.6
CPU - Sorting3028.85019.6
CPU - Single Threaded461.71806.9
Graphics 2D - Simple Vectors7.331.5
Graphics 2D - Complex Vectors26.3171.5
Graphics 2D - Fonts and Text57.5270.9
Graphics 2D - Windows Interface33.6116.3
Graphics 2D - Image Filters256.7793.6
Graphics 2D - Image Rendering211.0787.6
Graphics 2D - Direct 2D6.519.1
Graphics 3D - DirectX 9 Simple84.990.0
Graphics 3D - DirectX 9 Complex30.351.8
Graphics 3D - DirectX 104.824.6
Graphics 3D - DirectX 119.140.4
Graphics 3D - DirectCompute331.1859.0
Memory - Database Operations14.963.0
Memory - Read Cached6670.118128.2
Memory - Read Uncached4245.410675.4
Memory - Write4023.98123.7
Memory - Available RAM14290.55883.2
Memory - Latency61.527.2
Memory - Threaded21033.121258.4
Disk - Sequential Read60.1101.6
Disk - Sequential Write87.974.8
Disk - Random Seek + RW28.25.1
CPU Mark3817.07392.8
2D Graphics Mark193.4779.0
Memory Mark814.21931.3
Disk Mark637.2656.5
3D Graphics Mark679.51874.2
PassMark Rating1108.72310.5

System information - Lenovo_IdeaPad_Y510P

PerformanceTest Version

PerformanceTest 8.0 1051 64-bit

System summary

Windows 7 Professional Edition Service Pack 1 build 7601 (64-bit),
1 x Intel(R) Core(TM) i7-4700MQ CPU - 2.40GHz,
7.7GB RAM,
Intel(R) HD Graphics 4600, NVIDIA GeForce GT 750M,
932GB HDD,
DVD-RAM,
Battery:Battery Information
Battery ID41167LENOVO PABAS0241231
ManufacturerLENOVO
Serial Number41167
ChemistryLi-I
Long Term1
Design Capacity56380
Last Full Charge55680

General

System Name:VALUED-PC
Motherboard Manufacturer:LENOVO
Motherboard Name:20217
Motherboard Version:31900003Std
Motherboard Serial Number:YB00719083
BIOS Manufacturer:LENOVO
BIOS Version:74CN35WW(V1.10)
BIOS Release Date:07/18/2013

CPU

CPU manufacturer:GenuineIntel
CPU Type:Intel(R) Core(TM) i7-4700MQ CPU - 2.40GHz
Codename:Haswell
CPUIDFamily 6, Model 3C, Stepping 3
Socket:FCPGA946
Lithography:22nm
Physical CPU's:1
Cores per CPU:4
Hyperthreading:Enabled
CPU features:MMX SSE SSE2 SSE3 SSSE3 SSE4.1 SSE4.2 DEP PAE Intel64 VMX Turbo AES AVX AVX2 XOP FMA3
Clock frequencies:
- Measured CPU speed:2395.1 MHz [Turbo: 3393.0MHz]
- Multiplier:x24.0 [Turbo: x34.0]
- Base Clock:100.0 MHz
- Multiplier range:Min: x8, Max non turbo: x24 [Ratio: 4C: x32, 3C: x32, 2C: x33, 1C: x34]
Cache per CPU package:
- L1 Instruction Cache:4 x 32 KB
- L1 data cache:4 x 32 KB
- L2 cache:4 x 256 KB
- L3 cache:6 MB

Memory

Total Physical Memory:7916MB
Available Physical Memory:6673MB
Memory devices:
Slot 1:4GB DDR3 SDRAM PC3-12800
Ramaxel Technology RMT3170EB68F9W1600, serial#: 285036944, wk/yr: 26/2013
1.5V, 1.35V , Clk: 800.0MHz, Timings 11-11-11-28 (- Max. freq.)
Slot 2:4GB DDR3 SDRAM PC3-12800
Ramaxel Technology RMT3170EB68F9W1600, serial#: 284971408, wk/yr: 26/2013
1.5V, 1.35V , Clk: 800.0MHz, Timings 11-11-11-28 (- Max. freq.)
Slot 3:Not populated
Slot 4:Not populated
Virtual memory:C:\pagefile.sys (allocated base size 7916MB)

Memory SPD

DIMM#0
Memory type:DDR3 SDRAM
SPD revision:1.1
Manufacturer:Ramaxel Technology
Manufacturing date:Year: 2013, Week: 26
Serial number:10FD5190
Part number:RMT3170EB68F9W1600
Clock speed:800.0 MHz
Memory size:4096 MB
Number of banks:8
Row address bits:16
Column address bits:10
Bus width:64 bits
Device width:8 bits
Number of ranks:1
ECC:No
Module voltage:1.5V, 1.35V
Minimum clock cycle time (tCK):1.250 ns
Supported CAS latencies:5 6 7 8 9 10 11
Minimum CAS latency time (tAA):13.125 ns
Minimum RAS to CAS delay time (tRCD):13.125 ns
Minimum row precharge time (tRP):13.125 ns
Minimum active to precharge time (tRAS):35.000 ns
Supported timing at highest clock speed:11-11-11-28
Minimum Row Active to Row Active Delay (tRRD):6.000 ns
Minimum Active to Auto-Refresh Delay (tRC):48.125 ns
Minimum Recovery Delay (tRFC):260.000 ns
Minimum Write Recovery time (tWR):15.000 ns
Minimum Write to Read CMD Delay (tWTR):7.500 ns
Minimum Read to Pre-charge CMD Delay (tRTP):7.500 ns
Minimum Four Activate Window Delay (tFAW):30.000 ns
Operating temperature range:0-95C
Supports Auto Self-Refresh:No
Supports Partial Array Self-Refresh:Yes
Thermal Sensor present:No
Supports On-Die Thermal Sensor readout:No
Non-standard SDRAM type:Standard Monolithic
Module type:SO-DIMM
Module Height:29 - 30 mm
Module Thickness:Front: 1 - 2 mm, Back: 1 - 2 mm
Module Width:67.6 mm
Reference raw card used:Raw Card B Rev. 0
DIMM#1
Memory type:DDR3 SDRAM
SPD revision:1.1
Manufacturer:Ramaxel Technology
Manufacturing date:Year: 2013, Week: 26
Serial number:10FC5190
Part number:RMT3170EB68F9W1600
Clock speed:800.0 MHz
Memory size:4096 MB
Number of banks:8
Row address bits:16
Column address bits:10
Bus width:64 bits
Device width:8 bits
Number of ranks:1
ECC:No
Module voltage:1.5V, 1.35V
Minimum clock cycle time (tCK):1.250 ns
Supported CAS latencies:5 6 7 8 9 10 11
Minimum CAS latency time (tAA):13.125 ns
Minimum RAS to CAS delay time (tRCD):13.125 ns
Minimum row precharge time (tRP):13.125 ns
Minimum active to precharge time (tRAS):35.000 ns
Supported timing at highest clock speed:11-11-11-28
Minimum Row Active to Row Active Delay (tRRD):6.000 ns
Minimum Active to Auto-Refresh Delay (tRC):48.125 ns
Minimum Recovery Delay (tRFC):260.000 ns
Minimum Write Recovery time (tWR):15.000 ns
Minimum Write to Read CMD Delay (tWTR):7.500 ns
Minimum Read to Pre-charge CMD Delay (tRTP):7.500 ns
Minimum Four Activate Window Delay (tFAW):30.000 ns
Operating temperature range:0-95C
Supports Auto Self-Refresh:No
Supports Partial Array Self-Refresh:Yes
Thermal Sensor present:No
Supports On-Die Thermal Sensor readout:No
Non-standard SDRAM type:Standard Monolithic
Module type:SO-DIMM
Module Height:29 - 30 mm
Module Thickness:Front: 1 - 2 mm, Back: 1 - 2 mm
Module Width:67.6 mm
Reference raw card used:Raw Card B Rev. 0

Graphics

Intel(R) HD Graphics 4600
Chip Type:Intel(R) HD Graphics Family
DAC Type:Internal
Memory:2112MB
BIOS:Intel Video BIOS
Driver provider:Intel Corporation
Driver version:10.18.10.4358
Driver date:12-21-2015
Monitor 1:1920x1080x32 60Hz (Primary monitor)
NVIDIA GeForce GT 750M
Chip Type:GeForce GT 750M
DAC Type:Integrated RAMDAC
Memory:2048MB
BIOS:Version 80.7.9d.0.6
Driver provider:NVIDIA
Driver version:10.18.13.6143
Driver date:12-16-2015

Disk volumes

C: Local Drive, \\?\Volume{7beda826-fb45-11e5-8c85-806e6f6e6963}\, Windows, NTFS, (922.58GB total, 884.12GB free)
D: Optical drive, \\?\Volume{7beda82a-fb45-11e5-8c85-806e6f6e6963}\

Disk drives

Disk drive: Model: ST1000LM024 HN-M101MBB ATA Device Serial: S2SMJ9GD705286 (Disk: 0, Size: 931.51GB, Volumes: C)

Optical drives

MATSHITA DVD-RAM UJ8DB ATA Device

Network

Qualcomm Atheros AR8171/8175 PCI-E Gigabit Ethernet Controller (NDIS 6.20) (MAC: 28:D2:44:21:53:A7)
Intel(R) Centrino(R) Wireless-N 2230 (Speed: 130Mb/s) (MAC: 68:17:29:8B:87:BF)

Ports

Keyboard Port: PS/2 connector
Mouse Port: PS/2 connector

USB

Standard Enhanced PCI to USB Host Controller
- Intel(R) Wireless Bluetooth(R)
Standard Enhanced PCI to USB Host Controller
- USB Composite Device
Intel(R) USB 3.0 eXtensible Host Controller

PassMark(R) PerformanceTest 8.0 (http://www.passmark.com)
Results generated on: Wednesday, April 20, 2016